kbu6a thru kbu6m vishay semiconductors formerly general semiconductor document number 88657 www.vishay.com 17-jul-02 1 single-phase bridge rectifier reverse voltage 50 and 1000 v forward current 6.0 a maximum ratings & thermal characteristics ratings at 25? ambient temperature unless otherwise specified. kbu kbu kbu kbu kbu kbu kbu symbols 6a 6b 6d 6g 6j 6k 6m units maximum repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum average forward t c =100? (1) (2) 6.0 rectified output current at t a =40? (3) i f(av) 6.0 a peak forward surge current single sine-wave superimposed on rated load i fsm 250 a (jedec method) t j =150? typical thermal resistance per leg (2) r ja 8.6 r jc 3.1 ?/w operating junction and storage temperature range t j, t stg -50 to +150 ? electrical characteristics ratings at 25? ambient temperature unless otherwise specified. maximum instantaneous forward drop per leg at 6.0 a v f 1.0 v maximum dc reverse current t a = 25? 5.0 a at rated dc blocking voltage per leg t a =125? i r 1.0 ma notes: (1) recommended mounted position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 s crew (2) thermal resistance from junction to ambient with units in free air, p.c.b. mounted on 0.5 x 0.5 (12 x 12mm) copper pads, 0.3 75" (9.5mm) lead length (3) thermal resistance from junction to case with units mounted on a 2.6 x 1.4 x 0.06" thick (6.5 x 3.5 x.15cm) al. plate features ?plastic material used carries underwriters laboratory flammability classification 94v-0 ?this series is ul listed under the recognized component index, file number e54214 ?high case dielectric strength of 1500 v rms ?ideal for printed circuit boards ?high surge current capability ?high temperature soldering guaranteed: 250?/10 seconds, 0.375 (9.5mm) lead length, 5 lbs. (2.3kg) tension mechanical data case: molded plastic body terminals: plated leads solderable per mil-std-750, method 2026 mounting position: any (note 1) weight: 0.3 oz., 8.0 g packaging codes/options: 1/250 ea. per bulk tray stack 0.160 (4.1) 0.065 (1.7) 0.185 (4.7) 0.895 (22.7) 0.935 (23.7) 0.140 (3.6) 0.165 (4.2) 0.085 (2.2) 0.240 (6.09) 0.200 (5.08) 0.220 (5.6) 0.180 (4.6) 0.075 (1.9) r. typ. (2 places) 45 o 0.205 (5.2) 0.185 (4.7) 0.052 (1.3) 0.048 (1.2) 0.280 (7.1) 0.260 (6.6) dia. 0.760 (19.3) max. 0.700 (17.8) 0.660 (16.8) 1.0 (25.4) min. 0.455 (11.3) 0.405 (10.3) dimensions in inches and (millimeters) case style kbu
kbu6a thru kbu6m vishay semiconductors formerly general semiconductor www.vishay.com document number 88657 2 17-jul-02 ratings and characteristic curves (t a = 25? unless otherwise noted) temperature ( c) fig. 1 ?derating curve output rectified current average forward current (a) fig. 3 ?typical instantaneous forward characteristics per leg instantaneous forward voltage (v) instantaneous forward current (a) percent of rated peak reverse voltage (%) instantaneous reverse current ( a) fig. 4 ?typical reverse leakage characteristics number of cycles at 60 h z fig. 2 ?maximum non-repetitive peak forward surge current per leg peak forward surge current (a) reverse voltage (v) junction capacitance, pf fig. 5 ?typical junction capacitance per leg 0.6 0.7 100 1.0 1 0.1 0.8 0.9 1.0 1.1 1.2 1.3 0 20 40 60 80 100 0.01 0.1 1 10 50 50 100 150 0 2.0 4.0 6.0 0 10 100 75 100 125 150 175 200 225 250 1 1 10 100 10 100 400 t j = 100 c t j = 25 c p.c.b. mounting, t a 0.375" x (9.5mm) lead length with 0.5 x 0.5" (12 x 12mm) copper pad areas heatsink mounting, t c, 2.6 x 1.4 x 0.06" (6.5 x 3.5 x 1.5cm) al. plated t j = 150 c single sine-wave (jedec method) t j = 25 c pulse width = 300 s 1% duty cycle t j = 25 c f = 1.0mh z vsig = 50mvp-p 1.0 cycle
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